Jasper

• Rugged mechanical design with thicker PCB and latching connectors
• Built-in 16-bit data acquisition circuit with autocalibration
• Dimensions: 5.75” x 4.00” / 146 x 102mm (3.5 inch form factor)
• Available as complete solution with Intel 11th Gen Xeon COM / up to 96GB RAM
• Operating temperature: -40°C to +85°C

Jasper is a COM Express carrier board and SBC for Type 6 Basic (125×95mm) and Compact (95×95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime.

Notable features of Jasper include:

• Rugged mechanical design with thicker PCB and latching connectors
• Wide temperature operation — up to −40 to +85C (depending on the installed COM)
• Built-in 16-bit data acquisition circuit with autocalibration
• Dual minicard sockets with PCIe and USB interfaces
• Dual M.2 sockets for flash memory and network connectivity
• PCIe/104 expansion socket supporting x16 and x1 links

Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run «single-board computer» with an 11th generation Intel Xeon processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.

Flexible Design to Fit Any Application

The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a «cable-free» solution. Such a connector board can dramatically reduce assembly time and cost for the end system.

Rugged design

Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:

• The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
• Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness
• A bottom-side heat spreader provides more efficient cooling than a traditional heat sink
• All components are rated and/or tested to ensure reliable −40 to +85 o C operation

Thermal Dissipation

Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.

I/O Expansion

Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.

Cable Kit

The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.