Geode offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. With Geode you can add up to 3 I/O boards in the system without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design effort dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
A MIL-grade power supply with MIL-STD-461, −704, and −1275 compatibility and wide input range is available with both isolated and non-isolated configurations. For cost and weight reduction, a MIL-STD-461 filter circuit can be built right into the connector board, eliminating the separate power supply.
The COM is thermally coupled to the top surface of the enclosure. The filtered power supply is thermally coupled to the bottom surface of the enclosure. The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.
Geode is based on Diamond’s Jasper COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
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