MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
HPERC-KBL-MH
Rugged Convection Cooled System with Intel Xeon Processor and MIL-DTL-38999 Connectors
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel Xeon processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
Easy configuration and expansion allows for fast integration of custom rugged embedded applications. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. The HPERC reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface to enable image processing and other applications driven by AI and Deep Learning technologies.
Built with proven Ampro (acquired by ADLINK in 2008) reliability, the rugged capabilities of the HPERC are ideal for ground, air and sea deployments in military and aerospace. The HPERC systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.
In addition to Intel’s constantly evolving roadmap, NVIDIA’s many-core GPUs have transformed some areas of sensor processing, including radar, wide-area surveillance, and hyperspectral imaging, due the inherent suitability of parallel processing of those data sets. While this parallel processing paradigm has rapidly increased the processing capability within a given SWaP envelope, the real gains are yet to be exploited — the advent of Deep Learning will likely power the next wave of systems capabilities.
Image processing methods perform operations to enhance an image and/or extract useful information from it. Applications include pattern of life analysis, surveillance, reconnaissance, target identification, and geolocation in GPS-denied areas. For example, to collect tens of thousands of hours of aerial surveillance video and other theaters of operation. Turning what are often grainy, shaky videos taken by drones or satellites into clean image streams suitable for analysis — especially real-time analysis — poses a massive computational burden. According to NVIDIA and Motion DSP, GPUs can process such video seven times faster than CPU-only approaches.
Coupled with NVIDIA’s CUDA graphics processing and the OpenGL API, ADLINK’s HPERC, provides solution engineers with a powerful COTS (commercial off-the-shelf) sub-system with which they can design the next generation of image processing systems. More applications, including:
ISR platforms (intelligence, surveillance and reconnaissance)
Radar processing
Software-defined radio (SDR)
Sonar processing
Forward looking infrared radiometry (FLIR)
HPERC-KBL-MC
Extreme Rugged Cold Plate Mount System with Intel Xeon Processor and MIL-DTL-38999 Connectors
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel Xeon processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
Easy configuration and expansion allows for fast integration of custom rugged embedded applications. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. The HPERC reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface to enable image processing and other applications driven by AI and Deep Learning technologies.
Built with proven Ampro (acquired by ADLINK in 2008) reliability, the rugged capabilities of the HPERC are ideal for ground, air and sea deployments in military and aerospace. The HPERC systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.
In addition to Intel’s constantly evolving roadmap, NVIDIA’s many-core GPUs have transformed some areas of sensor processing, including radar, wide-area surveillance, and hyperspectral imaging, due the inherent suitability of parallel processing of those data sets. While this parallel processing paradigm has rapidly increased the processing capability within a given SWaP envelope, the real gains are yet to be exploited — the advent of Deep Learning will likely power the next wave of systems capabilities.
Image processing methods perform operations to enhance an image and/or extract useful information from it. Applications include pattern of life analysis, surveillance, reconnaissance, target identification, and geolocation in GPS-denied areas. For example, to collect tens of thousands of hours of aerial surveillance video and other theaters of operation. Turning what are often grainy, shaky videos taken by drones or satellites into clean image streams suitable for analysis — especially real-time analysis — poses a massive computational burden. According to NVIDIA and Motion DSP, GPUs can process such video seven times faster than CPU-only approaches.
Coupled with NVIDIA’s CUDA graphics processing and the OpenGL API, ADLINK’s HPERC, provides solution engineers with a powerful COTS (commercial off-the-shelf) sub-system with which they can design the next generation of image processing systems. More applications, including:
ISR platforms (intelligence, surveillance and reconnaissance)
Radar processing
Software-defined radio (SDR)
Sonar processing
Forward looking infrared radiometry (FLIR)
DLAP-201-JT2
NVIDIA Jetson TX2 Edge AI Inference Platform
Deploying AI at the edge can be a complex undertaking. ADLINK’s deep learning acceleration platforms (DLAP) offer scalable, power-efficient AI inference with support for the full lineup of NVIDIA Jetson family.
The DLAP series provides rich I/O interfaces and flexible expansion and support software development kits to reduce design time and efforts to accelerate edge AI deployment.
ADLINK DLAP series are fully compatible with Allxon Remote Device Management, a unified, centralized cloud portal for remote edge security management.
MXC-6600
9th Gen Intel Xeon, Core i7/i3 and 8th Gen Intel Core i5 Processor-Based Embedded Fanless Computer
The MXC-6600 Series provides powerful, fanless, expandable embedded computing using the new 9th Gen Intel Xeon, Core i7/i3 and 8th Gen Intel Core i5 processors with improved computing performance.
The MXC-6600 continues the exceptional fanless design from the existing Matrix C series and offers a rich I/O experience with dual DisplayPorts, and an HDMI port supporting three independent displays, two USB3.1 Gen2 ports, two USB 3.1 Gen1, six USB 2.0 and two GbE LAN ports with adapter teaming support. The built-in 16-channel DI/O enables general industrial control, while PCI & PCI express (Gen3) expansion slots accept a variety of PCI, PCIe x8, and PCIe x16 add-on cards for platform development operations.
Compared to other industrial PCs, the MXC-6600 Series is more compact and reliable with superior dependability in harsh environments where severe temperature variation and vibration may occur. The MXC‑6600 Series provides an optional hot-pluggable fan module to dissipate heat from the system when high power consumption PCI/PCIe cards are installed.
Additional function boards can be customized according to customer I/O needs. The Matrix MXC-6600 Series provides a more robust mechanical design, easy installation, and supports a greater variety of I/O options.
MXE-1400
Intel Atom E3845 Processor-Based Fanless Embedded Computer
ADLINK’s new Matrix MXE-1400 series of rugged quad‑core fanless computers, feature the latest generation of Intel Atom E3845 processors, delivering outstanding performance with minimum power consumption.
The MXE-1400 series accommodates rich I/O interfaces in a compact system size, including DisplayPort, DVI-I (with both DVI and VGA signals), three GbE by Intel network interface controllers, six USB 2.0, one USB 3.0 with dedicated bandwidth, 8 isolated DI/O, and six COM ports, four of which are BIOS-configurable among RS-232/422 and 485 with auto flow. In addition, with a 2.5″ SATA drive bay and CFast port, easy, versatile connection to a wide range of applications is enabled. Dual mini PCIe slots and USIM socket empower the MXE- 1400 as a communications hub for a variety of wireless connections, such as BT/WiFi and 3G/LTE.
Leveraging proprietary mechanical engineering, the MXE-1400 series continues to offer all the popular features of the Matrix E series, including cable-free construction, wide operating temperature ranges, and 5 Grms vibration resistance, having undergone, like all ADLINK Matrix devices, rigorous testing for operational verification.
Combining superior processor performance, wireless capability, and rich, scalable I/O in a compact and robust package, the ADLINK MXE-1400 is an ideal choice for a wide range of applications supporting intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.
MXE-1500
Intel Celeron N3160/ N3060 SoC Fanless Embedded Computer
The successor to ADLINK’s best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure.
Intel Celeron (Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
MXE-210
Intel Atom Processor E3900 Family-Based Ultra Compact Embedded Platform
ADLINK’s new Matrix MXE-210 series of ultra compact embedded platforms, based on the Intel Atom x5‑E3930/x7‑E3950 Processor, delivers optimum I/O design for maximum connectivity.
With two GbE LAN ports, two COM ports, two USB 2.0 and two USB 3.0 host ports, and dual mPCIe slots and USIM socket support communication with connections via Wi-Fi, BT, 3G, LoRa(SX1276), and 4G LTE, the MXE‑210 series enables seamless interconnection, ensuring interoperability between systems.
Matrix’s proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and extended operating temperatures of -40°C to +85°C available.
The MXE-210 series presents an intelligent, robust embedded system supporting wide application development and easy service deployment, for outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation, and Internet of Things (IoT) applications.
MXE-5600
9th Gen Intel Xeon, Core i7/i3 and 8th Gen Intel Core i5 Processor-Based Embedded Fanless Computer
ADLINK’s new Matrix MXE-5600 Series of fanless computers feature 9th Gen Intel Xeon, Core i7/i3 and 8th Gen Intel Core i5 processors, delivering outstanding performance with robust construction.
The MXE-5600 series accommodates rich I/O capabilities in a compact system size, with two DisplayPorts, one HDMI, two GbE by Intel Network Interface Controllers (NIC), four each of USB 2.0 and USB 3.1, eight DI/O, and two BIOS-configurable COM ports for RS-232/422/485.
With dual 2.5″ SATA drive bays and one CFast port, a wider variety of storage options is available. One Mini PCIe slot, one B-keyed M.2 slot and two USIM sockets empower the MXE-5600 Series as a communications hub for a variety of wireless connections, such as BT/WiFi and LTE.
Leveraging proprietary mechanical engineering, the MXE-5600 Series continues to offer all the popular features of the Matrix E series, including wide operating temperature ranges, and 5 Grms vibration resistance.
Combining superior processor performance, wireless capability, and rich, scalable I/O in a compact and robust package, the ADLINK MXE-5600 Series is an ideal choice for a wide range of applications supporting intelligent transportation, invehicle multimedia, surveillance, and factory automation applications.
MVP-5000
Value Family 6th Generation Intel Core i7/i5/i3 Processor-Based Fanless Embedded Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation Intel Core processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors.
Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK’s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
MVP-6010/6020 Series
Value Family 6th Generation Intel Core i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
ADLINK’s newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel Core processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
The MVP-6010/6020 Series supports dual-channel DDR4 memory for more powerful computing and the Intel HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications.
Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform.
