EPSM-12G2F
EPSM-12G2F 26-Port Miniature Rugged Managed Ethernet Switch Module EPSM-12G2F is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55×84mm) size offering 24x 10/100/1000Mbps copper ports and 2x 1-2.5Gbps SFP ports. It supports an embedded software package offering a full suite of Layer 2 managed Ethernet switching capabilities. The module is intended to be used on a carrier board to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the «last inch» of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions. EPSM-12G2F offers compelling advantages over in-house designed Ethernet switches requiring mid-range software features: Small size fits into robots, drones, and other applications where size and weight are critical Rugged design and wide temperature capability are ideal for vehicle applications where high levels of shock and vibration are present Off the shelf solution significantly reduces development time and risk Built-in embedded software provides the most popular managed switch features, all configurable via web or serial port interfaces, eliminating the need for any software development Embedded Software EPSM-12G2F includes the feature-rich WebStaX Layer 2 managed Ethernet switch software. The table below shows some of the more popular features included: 8K MAC addresses and 4K VLANs (IEEE 802.1Q) 8K IPv4 and IPv6 multicast group support Jumbo frame support at all speeds Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad) Multicast and broadcast storm control, as well as flooding control Rapid Spanning Tree protocol (RSTP) and MSTP Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X 8 priorities and 8 QoS queues per port with scheduling Cooling Options Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available. Development Support A design guide is available with circuit details and other technical information necessary to design a carrier board around the EPSM-12G2F. A development kit is also available including: A technical design package (schematics, PCB layout, and Bill of Materials) of the EPS-24G4X carrier board, featuring support for 12 1G ports from the module, PHY for 12 additional 1G ports, dual SFP sockets, LED control logic, and power supply circuit CPLD code for status LED control logic A complete EPS-24G4X switch with the EPSM-12G2F module installed A cable kit Free custom branding of the embedded software (logo / color / title only; custom configurations are extra charge)
JETBOX-Nano
JETBOX-Nano Rugged, durable enclosure for NVIDIA Jetson Nano development kit Ever since its introduction in March of 2019, the NVIDIA Jetson Nano computer-on-module has been capturing the hearts and minds of AI systems builders everywhere. JETBOX-nano™ is a low-cost enclosure for the Jetson Nano development kit. The all-steel enclosure provides a rugged, durable enclosure solution for the Jetson Nano that measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). The combination of the Jetson Nano development kit with the JETBOX-nano means users can deploy a professional quality NVIDIA Jetson system with almost 500 gigaFlops performance. The NVIDIA Jetson Nano Development Kit provides plenty of I/O for makers, learners, and developers. The JETBOX-Nano measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). Its 2-part design makes assembly quick and easy. In addition to the standard front-facing I/O connectors, the enclosure provides access to the serial port and camera flex cable port on the Nano development kit’s left side and the GPIO port on its right. A programming button on the rear enables easy software updates, and a DIN rail mount makes installation in end equipment easy. JETBOX-nano comes as an easy to construct kit that includes everything needed to construct the durable, quality enclosure designed to house the NVIDIA Jetson Nano development kit: Top and bottom enclosure pieces with assembly hardware Rear programming button DIN rail mounting bracket Optional GPIO cable (-02 model) Easy-to-follow instructions for building JETBOX-nano The JETBOX-nano enclosure kit is available in two configurations: The basic model and a GPIO-enabled model that includes a GPIO feature connector on the right side. The Nano development kit is purchased separately and is readily available from online vendors. Contact us for options regarding availability of a fully-assembled, ready-to-run system including the Nano development kit pre-installed.
SabreCom
SabreCom SabreCom Computers The SabreCom series of rugged mission computers brings an exciting level of price/performance to the market. These systems are based on Diamond’s line of rugged, I/O-rich single board computers and COM-based SBCs:. Aries features the Intel «Bay Trail» E3845 quad core CPU and a full set of PC I/O and optional data acquisition features. It features PC/104 and PC/104-Plus expansion capability for applications requiring additional I/O. Venus features the Intel «Skylake» 6th generation Core i7 CPU with onboard 4GB RAM expandable up to 20GB. It features PCI-104 and PCIe/104 OneBank expansion capability to support additional high-speed I/O such as additional Ethernet ports or video capture. Zeta offers «Bay Trail» and «Apollo Lake» CPU options using a family of interchangeable COMs (computer-on-modules). This design offers significant size and weight reduction over traditional single-board computers. I/O expansion is achieved with PCIe minicards. Models are available with integrated data acquisition or GPIO. All models include 4 serial ports with RS-232/422/485 capability, dual gigabit Ethernet, VGA and/or LCD and/or HDMI display, USB 2.0 / 3.0 ports, and GPIO. I/O expansion is readily accomplished through a combination of PC/104 and PCIe minicard expansion sockets. Thermal management is accomplished with effective conduction cooling of the SBC to the enclosure’s top heat sink surface, keeping electronics cool for reliable performance in extreme temperatures. Rugged performance is assured with full IP67 construction, −40°C to +85°C operation, and MIL-STD-810 shock and vibration compliance. Connectivity is via MIL-DTL-38999 connectors with stainless steel finish (type 20K). Customization capabilities include connector type and pinout, paint type and color, compliance to MIL-STD-461, MIL-STD-704, and/or MIL-STD-1275, and removable flash storage.
STB-104 Module
STB-104 Module STB-104: PC/104 Screw Terminal Board The STB-PC/104 is a miniature PC/104-format screw‑terminal board that enables you to easily connect sensors, control signals, etc. to a PC/104 system. A 50-pin connector is provided for mating with a short cable to any Diamond Systems data acquisition module. Each pin on the connector is brought out to a screw terminal, enabling you to easily add, remove, and modify wiring as needed without complicated cable construction and modifications. The screw terminals are angled for easy operation. This unique board is the same size as a PC/104 module, so it fits conveniently right on top of the PC/104 stack. All necessary mounting hardware is included. Dimensions: 3.55″ x 3.775″ Screw terminal height: 0.59″ above top of PCB Configuration: 3 rows of 16 terminals + 1 row of 2 terminals
Proto-104 Module
Proto-104 Module PC/104 Prototype Board The PROTO-PC/104 is a PC/104-format prototype board that mounts on top of the PC/104 stack and allows you to build a custom peripheral or interface for your PC/104 system. All necessary connectors and hardware are provided to reduce your component sourcing efforts. A sample schematic is included to show you how to build a simple interface to the PC/104 bus, including data I/O, address mapping, DMA, and interrupt operation.
Connectors and Spacers
Connectors and Spacers PC/104 Bus Headers and Mounting Spacers PC/104 Bus Headers Use these parts to add your own circuit to a PC/104 system, or to add a PC/104 module to your own custom board. These are the same headers used on all our PC/104 modules and are guaranteed to be compatible with any PC/104-compliant header. Order 64-pin (8-bit main bus) and 40-pin (16-bit bus extension) components separately. Standard headers shown are stackthrough, allowing you to mount a module above and below. Non-stackthrough headers have the female socket on top and solder tail pins, allowing you to mount a module on top only. PC/104 Standards for Bus Headers The 8-bit (64-pin) header is required on each PC/104-compliant or PC/104-compatible circuit board. The 16-bit (40-pin) header is optional and is not used by all modules. All of Diamond Systems’ PC/104 modules come with both headers. PC/104 Mounting Spacers We now offer PC/104 spacers for board mounting. These .600″ length spacers are a non-standard length and can be hard to find in small quantities. Order either in bulk quantity (4 per board required) using SPC-104, or as the MTG104 single-board mounting kit. The kit includes 4 each spacers, #4-40×1/4 screws, and #4 nuts.
SATADOM Flashdisks
SATADOM Flashdisks SATA Disk-on-Module Flashdisk Solid-State Storage - up to 256GB capacity! Install an MLC or SLC SATADOM Flashdisk module onto any of our Aries or Helix single board computers for rugged, lightweight, solid-state mass storage. The flashdisk module works just like a SATA disk drive and requires no drivers. It provides high-speed nonvolatile mass storage in capacities of 32GB to 256GB. The flashdisk mounts on a SATA disk-on-module connector and is held in place with two spacers and screws (included). It operates over −40ºC to +85ºC. SATADOM flashdisk features: SATA compatible interface Single-level cell (SLC) flash modules for faster transfer speeds, lower power consumption, and higher cell endurance Multi-level cell (MLC) flash modules for lower cost and higher storage density Burst read/write of 300MB/s Sustained read performance of up to 165MB/s (SLC), 155MB/s (MLC) Sustained write performance of up to 150MB/s (SLC), 80MB/s (MLC) Static wear-leveling scheme with dynamic block allocation increases life and optimizes performance Built-in hardware ECC enables up to 16/24 bit correction per 1K bytes Flash bad-block management Self-Monitoring, Analysis and Reporting Technology (SMART) Power failure management ATA secure erase TRIM enabled for improved performance Supports boot function for Windows Embedded Standard 7, Windows Embedded CE, and Linux Low power consumption: MLC typical 475mA when active and 135mA in sleep mode SLC typical 330mA when active and 95mA in sleep mode Dimensions: 40.0×30.0×9.0mm -40ºC to +85ºC operation RoHS compliant
mSATA Flashdisk
mSATA Flashdisk mSATA Flashdisk Solid-State Storage - up to 512GB capacity! Install a MLC or SLC mSATA flashdisk module onto any of our Atlas or Hercules III single board computers for rugged, lightweight, solid-state mass storage. The flashdisk module works just like a SATA disk drive and requires no drivers. It provides high-speed nonvolatile mass storage in capacities of 8GB to 512GB. The flashdisk mounts on a mSATA connector and is held in place with two spacers and screws (included). It operates over −40°C to +85°C. mSATA flashdisk features: SATA compatible interface Single-level cell (SLC) flash modules for faster transfer speeds, lower power consumption, and higher cell endurance Multi-level cell (MLC) flash modules for lower cost and higher storage density Burst read/write of 300MB/s Sustained read performance of up to 165MB/s (SLC), 155MB/s (MLC) Sustained write performance of up to 150MB/s (SLC), 80MB/s (MLC) Static wear-leveling scheme with dynamic block allocation increases life and optimizes performance Built-in hardware ECC enables up to 16/24 bit correction per 1K bytes Flash bad-block management Self-Monitoring, Analysis and Reporting Technology (SMART) Power failure management ATA secure erase TRIM enabled for improved performance Supports boot function for Windows Embedded Standard 7, Windows Embedded CE, and Linux Low power consumption: MLC typical 475mA when active and 135mA in sleep mode SLC typical 330mA when active and 95mA in sleep mode Dimensions: 50.8×29.85×6.0mm -40°C to +85°C operation RoHS compliant
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