DAQ-2200 Series
DAQ-2200 Series 64-CH, 12/16-Bit, Up to 3 MS/s Multi-Function DAQ Cards ADLINK DAQ-2204, DAQ-2205, and DAQ-2206 are high-density and high-performance multifunction DAQ cards. The devices can sample up to 64 AI channels with different gain settings and scan sequences. It makes them ideal for dealing with high-density analog signals with various input ranges and sampling speeds. These devices also offer differential mode for 32 AI channels in order to achieve maximum noise elimination The DAQ-2200 series also feature analog and digital triggering, 2-CH 12-bit analog outputs with waveform generation capability, 24-CH programmable digital I/O lines, and 2-CH 16-bit general-purpose timer/counters.
Express-RLP
Express-RLP COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel Core Mobile Processor ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel Core mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP. The module provides support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s, 4 display or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance. Equipped with Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the Express-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more.
Express-BD7
Express-BD7 COM Express Basic Size Type 7 Module with Up to 16 cores Intel Xeon D and Pentium D SoC The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly «Broadwell-DE»). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution. The Express-BD7 features Intel Virtualization Technology (including VT-x, VT-d, EPT), Intel Hyper-Threading Technology (up to 16 cores, 32 threads), Intel Trusted Execution Technology, Intel AES-NI Technology, and DDR4 ECC (or non-ECC) dual-channel memory at 1866/2133/2400 MHz (dependent on SoC SKU) to provide excellent overall performance. An integrated Intel 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time. The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory. Input/output features include 16 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
Express-ID7
Express-ID7 COM Express Rev. 3.1 Type 7 Basic Size Module with Intel Xeon D-1700 Processor ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel Xeon D-1700 processor and features integrated high-speed Ethernet for up to 4×10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices. Built for rugged and edge AI applications, this ADLINK COM with Intel Ice Lake-D empowers system integrators to realize all of their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.
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