MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
EGX-MXM-P1000
Embedded MXM GPU Module with NVIDIA Quadro Embedded P1000
The EGX-MXM-P1000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 512 NVIDIA CUDA cores and a peak single-precision floating-point performance of 1.8 TFLOPS.
The EGX-MXM-P1000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%.
Additionally, 4 UHD display outputs and an extended operating temperature range of −40°C to 85°C are supported.
The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.
Q7-BW
Qseven Standard Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET.
The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers" needs for minimal space. Qseven"s power consumption envelope is below a 12 watts target, whereas SMARC"s target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express.
The Qseven pincount is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.
The ADLINK Q7-BW computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Q7-BW is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
nanoX-TC
COM Express Mini Size Type 10 Module
No bigger in size than a business card, the nanoX-TC is a COM Express Mini form factor Type 10 pinout compatible computer-on-module that targets battery powered, mobile and handheld system designs. The new Mini size form factor with a footprint of just 55 mm x 84 mm is the smallest size in ADLINK's COM Express product lineup, next to the Basic size (125 mm x 95 mm) and Compact size (95x95) form factors.
The nanoX-TC is based on the Intel® Atom™ Processor E6xx with less than 3.9 W thermal design power (TDP). These new 45nm Intel architecture processors implement ground-breaking power management techniques, making them ideal for thermally constrained and fanless embedded applications. The Processor E6xx series offers an integrated 2D/3D graphics engine with hardware encode/ decode, LVDS and SDVO output, HD Audio, PCI Express, and support for Intel® Hyper-Threading and Intel® Virtualization Technology.
The Intel® EG20T Platform Controller Hub (PCH) provides additional I/O flexibility with SATA, UART, Gigabit Ethernet and USB host/client support.
The nanoX-TC allows for innovative designs in mobile and "light" computing, including portable and mobile equipment for the automotive and test and measurement industries, visual communication and in the medical field. Using the Intel® Atom™ Processor E6xx and Intel® EG20T PCH chipset, the nanoX-TC allows developers to utilize a wide variety of mainstream software applications and middleware familiar to end users that will run unmodified with full functionality on this platform.
LEC-BW
SMARC Short Size Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. The
ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
Express-IBE2
COM Express Basic Size Type 2 Module
The Module Computing Product Segment (MCPS) is pleased to introduce its latest COM Express Type 2 Module with Intel Core i7/i5/i3 Processor and QM77 Chipset, the Express-IBE2.
The Express-IBE2 is a COM Express COM.0 R2.1 Type 2 module with a 3rd Generation Intel Core i7/i5/3 processor and support for error-correcting code (ECC) memory.
Based on the latest Mobile Intel® QM77 Express Chipset, the Express-IBE2 is specifically designed for customers who need a highly reliable platform and/or continued support for PCI-bus and PATA IDE in a long product life solution.
The Express-IBE2 features the Intel Core i7/i5/i3 processor supporting Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1066/1333/1600 MHz with error-correcting code (ECC). Integrated HD Graphics 4000 includes features such as OpenGL 3.1, DirectX11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and SDVO.
In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity. The Express-IBE2 features a single onboard Gigabit Ethernet port, eights USB 2.0 ports, two SATA 6 Gb/s ports, two SATA 3 Gb/s ports and one PATA IDE port. Support is provided for SMBus and I2C.
The module is equipped with an SPI AMI EFI BIOS and supports SEMA (Smart Embedded Management Agent). SEMA functionality is consistent over ADLINK"s whole COM product line and provides the following embedded features : BIOS failsafe, voltage/current/temperature monitoring, power sequence control and monitoring, watchdog control, board info and statistics. SEMA comes with extensive software and library support for Windows, Linux, VxWorks and QNX.
The ADLINK Express-IBE2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-IBE2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-IB
COM Express Basic Size Type 6 Module
The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel Core i7/i5/i3 processor supporting Intel HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).
The Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is ideal for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality. The Express-IB supports Intel® Advance Vector Extensions (Intel® AVX v1.0), with its improved Floating Point Intensive Applications, and also offers the benefits of increased bandwidth provided by USB 3.0.
Express-HR
COM Express Type 6 Module
The Express-HR is a COM Express™ COM.0 R2.0 Type 6 modules supporting the 64-bit Intel® Core™ i7/i5 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM67 Express chipset, the Express-HR is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-HR features the Intel® Core™ i7/i5 processor supporting Intel® Hyper-threading Technology (4 cores, 8 threads) and up to 16GB of DDR3 dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel® QM67 Express chipset.
Integrated HD Graphics 3000 includes features such as OpenGL 3.0, DirectX10.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include CRT, LVDS and three DDI ports supporting HDMI / DVT / DisplayPort or SDVO. The Express-HR is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-HR has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel® Mobile QM67 Express chipset integrates CRT and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express® connectivity.
The Express-HR features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports with optional support for RAID 0/1/5/10. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
Express-HLE
COM Express Basic Size Type 6 Module
The Express-HLE is a COM Express COM.0 R2.1 Type 6 module supporting the 64-bit 4th Generation Intel Core i7/i5/3 processor with CPU (formerly codenamed Haswell), memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel QM87 Express chipset, the Express-HLE is specifically designed for customers who need high-level processing and graphics performance in a long product life solution.
The Express-HLE features the Intel Core i7/i5/i3 processor supporting Intels Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance with ECC memory supported. Intel Flexible Display Interface and Direct Media Interface provide high speed connectivity to the Intel QM77 Express chipset.
Integrated Intel Generation 7.5 includes features such as OpenGL 3.1, DirectX11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI / DVI / DisplayPort. The Express-HLE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The Express-HLE has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The Intel Mobile QM87 Express chipset integrates VGA and dual-channel 18/24-bit LVDS display output. In addition to the onboard integrated graphics, a multiplexed PCI Express? x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4 PCI Express connectivity.
The Express-HLE features a single onboard Gigabit Ethernet port, four USB 3.0 ports and four USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
The ADLINK Express-HLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-HL2
COM Express Basic Size Type 2 Module
ADLINK"s Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor (codename: Haswell) - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.
The ADLINK Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Express-CVC
COM Express Compact Size Type 2 Module
The Express-CVC is a low power, low cost, COM Express Type 2, COM.0 R2.1 module in Compact form factor that is specially designed to facilitate speedy development of semi custom designs. The COM Express standard embodies the convergence of the latest technology standards based on serial differential signaling such as PCI Express, USB 2.0, SATA and LVDS implemented on a compact size Computer on Module. Signals are brought out through two 220-pin board-to-board connectors that permit data transmission rates of up to 5GHz.
Mounting holes connect the module with a custom-made, application specific carrier boards which provide protection from shock and vibration.
The Express-CVCis positioned as an entry level COM Express module for systems that require a small footprint with dual core computing power and DDR3 memory. It is ideal for applications that require Floating Point CPU performance with average graphics support and moderate power consumption levels, such as Robotics, Industrial control and Data Communications. The module supports three different types of a 32nm process Intel® Atom™ processors : Intel® Atom™ N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel® Atom™ N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel® Atom™ D2700 processor (1M Cache, 2.13 GHz) with 10W TDP.
The Intel® Atom™ processor integrates a graphics processing unit (GPU) has twice the performance as earlier generation Atom GPU and provides CRT and single channel LVDS. The Intel® Atom™ processors all support daul cores and Hyper-Threading Technology with 2-threads per core allowing the Express-CVC to provide excellent performance for multi-tasking or multi OS applications.
The Intel® NM10 PCH allows connection of up to three additional PCI Express x1 ports, while supporting the LAN controller on the 4th port. The module comes with a single onboard Gigabit Ethernet port and one SATA ports. It has legacy support for a single parallel IDE channel, 32-bit PCI and LPC.
The Express-CVC comes equipped with AMI UEFI BIOS supporting embedded features such as: Remote Console, CMOS backup in 16Mbit SPI BIOS, CPU and System Monitoring and Watchdog Timer.
The ADLINK Express-CVC computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-CVC is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
