MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
Geode-JSP
Quick-Ship Easy-Expansion Rugged Systems
Geode-JSP offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. With Geode-JSP you can add up to 3 I/O boards in the system without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design effort dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
A MIL-grade power supply with MIL-STD-461, −704, and −1275 compatibility and wide input range is available with both isolated and non-isolated configurations. For cost and weight reduction, a MIL-STD-461 filter circuit can be built right into the connector board, eliminating the separate power supply.
The COM is thermally coupled to the top surface of the enclosure. The filtered power supply is thermally coupled to the bottom surface of the enclosure. The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.
Geode-JSP is based on Diamond’s Jasper COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
JETBOX-Nano
Rugged, durable enclosure for NVIDIA Jetson Nano development kit
Ever since its introduction in March of 2019, the NVIDIA Jetson Nano computer-on-module has been capturing the hearts and minds of AI systems builders everywhere. JETBOX-nano™ is a low-cost enclosure for the Jetson Nano development kit. The all-steel enclosure provides a rugged, durable enclosure solution for the Jetson Nano that measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). The combination of the Jetson Nano development kit with the JETBOX-nano means users can deploy a professional quality NVIDIA Jetson system with almost 500 gigaFlops performance.
The NVIDIA Jetson Nano Development Kit provides plenty of I/O for makers, learners, and developers.
The JETBOX-Nano measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). Its 2-part design makes assembly quick and easy. In addition to the standard front-facing I/O connectors, the enclosure provides access to the serial port and camera flex cable port on the Nano development kit’s left side and the GPIO port on its right. A programming button on the rear enables easy software updates, and a DIN rail mount makes installation in end equipment easy.
JETBOX-nano comes as an easy to construct kit that includes everything needed to construct the durable, quality enclosure designed to house the NVIDIA Jetson Nano development kit:
Top and bottom enclosure pieces with assembly hardware
Rear programming button
DIN rail mounting bracket
Optional GPIO cable (-02 model)
Easy-to-follow instructions for building JETBOX-nano
The JETBOX-nano enclosure kit is available in two configurations: The basic model and a GPIO-enabled model that includes a GPIO feature connector on the right side. The Nano development kit is purchased separately and is readily available from online vendors. Contact us for options regarding availability of a fully-assembled, ready-to-run system including the Nano development kit pre-installed.
Midi
Box PC with wide temperature performance and abundant I/O
MIDI systems provide an efficient solution for customers seeking a Box PC with wide temperature performance and abundant I/O. MIDI systems feature expansion-ready front panels with removable cover plates to expose additional connector cutouts. The enclosure can easily accommodate up to two additional PC/104 style I/O modules or PCIe MiniCards. The cover plate provides ample cooling for Diamond’s rugged conduction-cooled SBCs. Table-top, wall mount, and DIN rail mounting options are all included.
MIDI systems are available in a variety of standard configurations based on Diamond’s Aries (Bay Trail x86), Venus, and Eagle / Eaglet (ARM) SBCs.
SabreNet-12000
Rugged 12-Port Managed Gigabit Ethernet Switch
SabreNet-12000 is a compact rugged switch featuring 12 ports of 10/100/1000Base-T managed Ethernet. The switch is based on Diamond’s EPS-12000 compact Ethernet board-level switch. The ports are arranged in groups of 4 and 8 on two MIL-DTL-38999 connectors.
The SabreNet-12000 includes embedded Layer 3 routing/switching software with optional IEEE1588 / PTP feature. The switch can be managed via a web interface on any of the ports as well as a local RS-232 port accessed on the 4-port connector.
SabreNet-12000 has passed MIL-STD-810G shock and vibration testing.
Power Supply Options
Two power and enclosure configurations are available:
Models numbered 1xx include a MIL-STD-461 power filter module and support an input voltage range of 7-34VDC. These units are housed in the short enclosure.
Models 2xx include a MIL grade isolated power supply based on Diamond’s JMM-7500, which provides compliance to MIL-STD-461, MIL-STD-704, and MIL-STD-1275 and supports an input range of 9-60VDC. These units are housed in the taller enclosure.
SabreCom-VNS
Rugged Mission Computers with Core i7 CPU and I/O Expandability
The SabreCom series of rugged mission computers brings a competitive level of price/performance to the market. These systems are based on Diamond’s line of rugged, I/O-rich single board computers. SabreCom-VNS is the standard model and is based on Diamond's Venus rugged SBC with 7th Generation Intel «Kaby Lake» Core i7 processor with a combination of features making it ideal for rugged environments. Latching I/O connectors, thicker PCB, soldered + ruggedized SODIMM memory, and integrated heat spreader / mounting plate make Venus the perfect platform for mid-to high-level CPU performance in a compact and affordable package.
SabreCom Venus is available in a standard configuration with competitive leadtime and without minimum order quantity or NRE charges. Customization with additional I/O modules and power supplies, as well as custom connectors and case designs, is available with moderate design fees and low minimum order quantities. Contact us to learn how Diamond is changing the game for cost-effective yet high-quality and high-reliability rugged computer systems and Ethernet switches.
Environmental Qualification
SabreCom systems have been tested and qualified to MIL-STD-202G shock and vibration levels to assure reliable performance in the most rugged vehicle applications. The sealed enclosure design features gaskets on all mating surfaces as well as all connector mounting screws to provide IP67 environmental protection. Unlike other rugged enclosures, the main body consists of a single block of aluminum milled to create a seamless 4-wall structure, eliminating the T joints that can be a source of leakage. All SabreCom systems are operational up to the full temperature range of the embedded SBC due to the efficient conduction cooling of the CPU directly to the top heat sink cover of the enclosure.
Mass storage
Mass storage of 256GB TLC technology is included as standard. Storage can be increased up to 1TB as an option using SATA DOM and mSATA modules. SLC technology is available.
Power supply
SabreCom systems are powered by Diamond’s rugged JMM-7500 power supply. This power supply features 80 watts output power with optional isolation and MIL-STD-461/704/1275 compliance.
Operating systems
Your choice of Linux or Windows 10 64-bit OS can be preloaded onto the flashdisk. Windows 10 OS features Diamond’s Power Loss Protection™ feature that survives repeated instant removal of power without requiring to wait for the normal Windows shutdown process.
ZiggyBox
Compact, cost-effective system for NVIDIA Jetson TX2/TX2i modules
The ZiggyBox provides a compact and highly cost effective solution for AI at the edge and machine learning applications for industrial and lab applications. It is based oround the NVIDIA Jetson TX2/TX2i advanced computing module with NVIDIA Pascal-family GPU technology. The Jetson module is housed in a rugged miniature enclosure measuring only 63x67x96mm / 2.4x2.6x3.7".
ZiggyBox offers easy access to the most popular Jetson I/O features, including Ethernet, USB 3.0 / 2.0 / OTG ports, HDMI display, and 2 RS-232 ports. The built-in carrier board adds a valuable data acquisition circuit with real-world analog and digital I/O features and software support. An integrated heat sink provides reliable operation at up to 85°C without forced air. With its integrated Linux OS and table-top / DIN rail mounting options, ZiggyBox is ready to be deployed wherever the combination of high-performance computing and ultra-compact size are required.
Data Acquisition
ZiggyBox contains a full-fledged analog and digital I/O circuit that provides control and monitoring of real-world events such as sensor inputs, temperature control, keypads/switches, and industrial processes. The 6 analog inputs feature 0-3.3V input range and programmable 12-bit up to 16-bit resolution, with user-controllable filtering and averaging for noise reduction. The 2 analog outputs offer 12-bit resolution and 0-3.3V output range. The 13 DIO feature 3.3V logic levels. All features are supported by Diamond’s built-in data acquisition driver software, featuring a programming library with application demos plus an interactive GUI-based control program that offers real-time access and control.
DLAP-411-Orin Supreme
Compact Edge AI Platform for Industrial GenAI Applications
ADLNK DLAP-411-Orin Supreme series, the Edge GenAI Platform, powered by NVIDIA Jetson AGX Orin and integrated with Phison’s innovative aiDAPTIV+ AI solution, is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
DLAP-411-Orin Supreme series overcomes memory limitations in edge generative AI applications, significantly enhancing AI computing capabilities on edge devices.
Without increasing high hardware costs, the DLAP Supreme series achieves notable AI performance improvements, helping enterprises reduce the cost barriers of AI deployment and accelerating the adoption of generative AI across various industries, especially in edge computing.
DLAP-211-Orin Series
Deep Learning Acceleration Platform Powered by NVIDIA Jetson Orin NX or Nano module
Introducing the DLAP-211-Orin Series, an exceptional edge AI inference platform designed to deliver unparalleled high-performance computing capabilities.
This highly adaptable solution caters to the demands of various industrial IoT applications, including smart cities, smart tourism initiatives, public and road safety, automated optical inspection, machine vision inspection, agriculture and aquaculture management, retail, healthcare, autonomous vehicles, robotics, and more.
Powered by the Jetson Orin System-on-Module (SoM), the DLAP-211-Orin Series combines a highly optimized compute engine, a multi-instance GPU, and a dedicated deep-learning accelerator.
The device impresses with its compact size, expandability, dependability, and up to 8 times greater AI performance compared to its predecessors. It offers hardware acceleration for deep learning, advanced safety and security features, and support for multiple sensors and cameras.
With its exceptional feature set, the DLAP-211-Orin Series enables developers to build advanced AI-powered edge solutions with a strong emphasis on performance, flexibility, safety, and security. This makes it the ideal choice for cutting-edge edge computing applications that require top-notch technology.
MCM-100
Intel Atom x7-E3950 Processor-Based Machine Condition Monitoring Edge Platform
The ADLINK new MCM-100 machine condition monitoring edge platform, highlighting continuous 24/7 data collection and vibration measurement with maximized precision and sampling rates for rotating machinery and equipment.
Integrating data collection, vibration analysis algorithms, computation, and network connection tasking in a single system, the MCM-100 enables rotating machinery, tooling, and plant and automation equipment operators to easily overcome challenges inherent in conventional equipment maintenance.
EOS-1300
4CH GigE Vision Compact Vision System with 6th Generation Intel Core i7 Processors
Adlink’s EOS-1300 is a high performance compact vision system equipped with 6th Generation Intel Core i7 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s.
EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
The EOS-1300 DI/O provides minimal and fixed latency without occupying CPU resources. The DI/O function provides APIs allowing programming for de-bounce filter of DI, delay time, and pulse width of DO and also advanced Encoder functions suitable for conveyor applications. The highly flexible design supports either Sink or Source DO via external wiring.
With all I/O connectors on one side for easy installation, and the latest 6th Generation Intel Core i7 processor, powerful and flexible DI/O, and compact size, the EOS-1300 is the perfect vision system for automation and machine vision.
