MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
Emerald-MM-8E/EL
PCI/104-Express 4/8-Port Serial Port Module with Opto-isolation
The Emerald-MM-8EL-XT is a family of high performance PCIe/104 «OneBank» serial I/O modules offering 4 or 8 multiprotocol serial ports with software-controlled configuration and optional opto-isolation. An accessory microcontroller manages all port configuration and provides 8 auxiliary digital / analog I/O lines for general purpose use.
The serial ports are based on a high speed PCIe octal UART with 256-byte TX/RX FIFOs and auto RS-485 transmit control. Each serial port can be independently configured for RS-232, RS-422, or RS-485 protocols, along with programmable 120-ohm line termination. Each port is independently isolated with an isolated power + signal chip, plus additional isolators for control signals. The board features intelligent power management that limits inrush current on power-up and also enables power-down of unused serial ports for power savings.
Opto-isolated models feature independent 2500VRMS isolation circuits for enhanced reliability in vehicle or long cable applications. All ports also feature +/-15KV ESD protection. Each serial port is available on an independent latching connector for increased isolation and ruggedness. With its wide operating temperature range and high resistance to shock and vibration, the EMM-8EL-XT fits a wide variety of rugged and on-vehicle embedded serial I/O application needs.
EMM-8EL-XT also offers 8 digital/analog I/O lines which are programmable from the on-board microcontroller. Each I/O line can be configured for digital input or output. Seven of the I/O lines can be configured for 12-bit A/D input with selectable 0-2.048V or 0-3.3V input ranges.
EMM-8EL-XT contains no configuration jumpers; all configuration and control is done with an onboard microcontroller using application software included with the product. All configuration settings are stored in the microcontroller’s flash memory and are automatically loaded on power-up.
Cable Kits
Cable kits are available for both 4-port and 8-port boards They include individual cables with dB9 male connectors for each serial port and a ribbon cable for the auxiliary analog/digital I/O.
Configuration software
The EMM-8E family includes an on-board microcontroller to handle all configuration and control of the board’s features. The microcontroller is managed with a comprehensive software suite that makes configuring the EMM-8E fast and simple. A graphical control panel, a console application, and drivers for Windows and Linux are provided to enable convenient configuration of the board and control of the I/O features in a laboratory or system assembly environment, or embedded in the customer’s application software.
E104-MPE
PCI/104-Express Quad PCIe MiniCard Carrier
The PCIe MiniCard carrier provides up to four PCIe MiniCard sockets on a PCI/104-Express form factor board. All four sockets have PCIe x 1 and USB interfaces and support full size and half size PCIe MiniCard modules.
The module provides full support to all sockets while consuming only a single lane of host SBC resources. SIM card support is provided for two sockets.
All power is derived from the PCIe/104 connector 5V power tab. The PCI-104 connector provides a pass through connection and is not used by the module.
Extended temperature capability (-40°C to +85°C) enables the board to operate in environments with extreme temperature swings, such as vehicles or outdoor installations. For further enhanced ruggedness, zero ohm resistors can replace jumpers.
Geode-OSB
Rugged system with Nvidia Jetson AGX Orin supporting up to 8 GMSL cameras
The Geode-Osbourne computer system platform offers easy customization and quick delivery, due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O. Geode is based on Diamond’s Osbourne carrier board for Nvidia Jetson AGX Orin. The system can support all three Orin modules: AGX Orin 32GB, AGX Orin 64GB, and Orin Industrial 64GB.
The I/O connector scheme consists of a mix of standard 38999 connectors plus dedicated SJT style connectors to support both low-speed and high-speed signals cost-effectively. In the high-speed category, Geode Osbourne supports 10Gb copper Ethernet, two USB 3.2 ports, and an HDMI port. Low-speed I/O consists of a 1Gb Ethernet port, 2 USB 2.0 ports, 2 RS-232 and 2 RS-232/422/485 serial ports, 2 CAN ports, 8 GPIO 3.3V, and Audio.
Since no two rugged computer systems are exactly alike, Geode supports up to 60 additional I/O signals and two SMA antenna connectors for I/O expansion. This enables the installation of minicard and M.2 I/O modules without requiring any change to the enclosure or cabling. The elimination of custom design and manufacturing efforts dramatically reduces up-front costs and delivery times. The resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
A GMSL camera adapter board can be installed into the system to facilitate the connection of up to 8 GMSL cameras to the system. And a rugged, isolated, wide-range-input power supply featuring MIL-STD-461, −704, and −1275 compliance can be installed as an option. The power supply and Jetson module are mounted directly to the bottom and top enclosure lids, respectively, to improve heat dissipation and keep the interior cooler for more reliable long-term operation.
Geode consists of a 3-part aluminum CNC enclosure that eliminates T joints to improve sealing. All joints and connector cutouts utilize sealing gaskets to support an IP67 rating. The Geode series was designed to meet MIL-STD-810H shock and vibration specifications.
Panel I/O Board
Geode-Osbourne’s internal architecture utilizes a direct-mount panel I/O board to eliminate most internal cables. The board contains a mix of standard 38999 and high-speed connectors to support the full range of I/O provided by the Jetson AGX Orin module and the carrier board electronics. It also includes a MIL-STD-461 filter for economical configurations where a full rugged MIL-grade power supply is not desired.
I/O Expansion
The Osbourne carrier board includes 2 minicard sockets and an M.2 E-Key socket for installing I/O and connectivity expansion modules. The Panel I/O board provides 3 connectors to bring out the I/O from installed expansion modules without requiring enclosure redesign. It has capacity for up to 60 I/O signals. Two SMA connectors are also provided on the front face of the enclosure for installed communications modules.
SabreNet-24000
Rugged 24+4 Port Ethernet Switch
SabreNet-24000 is a rugged ethernet switch intended for vehicle and other applications requiring the ability to withstand harsh environmental conditions. The design is based on Diamond's EPS-24G4X Ethernet switch with 24x 1G ports and 4x 10G SFP+ sockets. The switch runs Istax Layer 3 routing/switching embedded software featuring an impressive array of features suitable for most industrial and military applications.
The standard configuration includes the 4x 10G ports implemented with copper wiring via M12 X-coding connectors. Customer choice of fiber links can be accommodated as well. In the fiber configuration, the SFP+ Copper/RJ-45 modules are replaced with customer's choice of fiber modules with LC connections, and the I/O connectors consist of D38999 size C shells with 4 fiber termini (2 ports) per shell.
Input power range is 7-40VDC. The switch includes a power filter module providing compliance with MIL‑STD‑461‑D standards.
Embedded Software
The Istax embedded software in SabreNet-24000 provides a powerful array of features to support most embedded switch application requirements. All features are configured and managed via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port. Customer branding is available to put your logo / color scheme / part numbers on the GUI and serial interface.
The table below shows some of the more popular features included in the software:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Hardware- and software-based IPv6 L3 static routing
RFC 2328 OSPFv2 dynamic routing
IEEE 1588 precision time protocol (PTP)
RADIUS accounting
Port and Queue policers
EPS-12002L
Compact 12+2 Port Managed Ethernet Switch
Main features:
Rugged Ethernet switch for vehicle and other harsh environment applications
12 gigabit Ethernet ports for twisted pair connections
2 1/2.5/5/10G SFP+ sockets for fiber or copper transceivers
All ports feature non-blocking wire-speed performance
Layer 2+ switching and Layer 3 routing software available
IEEE 1588 PTP support available
Software customization and branding available
Rugged design with latching connectors
-40 to +85°C operating temperature
5.3×2.2″ / 136×55mm
Heat sink and heat spreader thermal options
The EPS-12002L is a compact managed rugged Ethernet switch based on Diamond’s EPSM-10GX Ethernet switch module. The switch consists of the EPSM-10GX module mounted on a carrier board that provides power, magnetics, and connectors, along with a heat sink or heat spreader.
EPS-12002L provides 12x 10/100/1000Mbps copper ports and 2x 1/2.5/5/10Gbps SFP+ sockets for fiber or copper transceivers. EPS-12002L is ideal for vehicle and industrial applications requiring a small form factor with gigabit Ethernet switching and fiber connectivity support.
Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.
EPS-12002L is designed specifically to meet the challenges of vehicle and other rugged environments, with its −40/+85°C operating temperature range, latching I/O connectors, and MIL-STD-202G shock/vibration resistance. A 5-36V input power supply provides compatibility with a range of industrial and vehicle power supplies.
Embedded Software
Two software packages are available: Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to install a precision clock circuit on the board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port. Customer branding is available to put your logo / color scheme / part numbers on the GUI and serial interface.
The table below shows some of the more popular features available.
Layer 2+ software highlights include the following:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Layer3 software additional highlights:
Hardware- and software-based IPv6 L3 static routing
RFC 2328 OSPFv2 dynamic routing
IEEE 1588 precision time protocol (PTP)
RADIUS accounting
Port and Queue policers
Cable Kit
Cable Kit for EPS-12000-CM: 3x Quad Gigabit Ethernet cables, Power cable, Serial cable.
EPSM-12G2F
26-Port Miniature Rugged Managed Ethernet Switch Module
EPSM-12G2F is a managed Ethernet switch module in an ultra-compact 2.2″ x 3.3″ (55×84mm) size offering 24x 10/100/1000Mbps copper ports and 2x 1-2.5Gbps SFP ports. It supports an embedded software package offering a full suite of Layer 2 managed Ethernet switching capabilities.
The module is intended to be used on a carrier board to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the «last inch» of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions.
EPSM-12G2F offers compelling advantages over in-house designed Ethernet switches requiring mid-range software features:
Small size fits into robots, drones, and other applications where size and weight are critical
Rugged design and wide temperature capability are ideal for vehicle applications where high levels of shock and vibration are present
Off the shelf solution significantly reduces development time and risk
Built-in embedded software provides the most popular managed switch features, all configurable via web or serial port interfaces, eliminating the need for any software development
Embedded Software
EPSM-12G2F includes the feature-rich WebStaX Layer 2 managed Ethernet switch software. The table below shows some of the more popular features included:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Cooling Options
Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available.
Development Support
A design guide is available with circuit details and other technical information necessary to design a carrier board around the EPSM-12G2F. A development kit is also available including:
A technical design package (schematics, PCB layout, and Bill of Materials) of the EPS-24G4X carrier board, featuring support for 12 1G ports from the module, PHY for 12 additional 1G ports, dual SFP sockets, LED control logic, and power supply circuit
CPLD code for status LED control logic
A complete EPS-24G4X switch with the EPSM-12G2F module installed
A cable kit
Free custom branding of the embedded software (logo / color / title only; custom configurations are extra charge)
Geode-JSP
Quick-Ship Easy-Expansion Rugged Systems
Geode-JSP offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. With Geode-JSP you can add up to 3 I/O boards in the system without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design effort dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.
A MIL-grade power supply with MIL-STD-461, −704, and −1275 compatibility and wide input range is available with both isolated and non-isolated configurations. For cost and weight reduction, a MIL-STD-461 filter circuit can be built right into the connector board, eliminating the separate power supply.
The COM is thermally coupled to the top surface of the enclosure. The filtered power supply is thermally coupled to the bottom surface of the enclosure. The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.
Geode-JSP is based on Diamond’s Jasper COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.
Jasper
Rugged COM Express Type 6 Carrier Board and SBC with Rich I/O and Expansion
Jasper is a COM Express carrier board and SBC for Type 6 Basic (125×95mm) and Compact (95×95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime.
Notable features of Jasper include:
Rugged mechanical design with thicker PCB and latching connectors
Wide temperature operation — up to −40 to +85C (depending on the installed COM)
Built-in 16-bit data acquisition circuit with autocalibration
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory and network connectivity
PCIe/104 expansion socket supporting x16 and x1 links
Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run «single-board computer» with an 11th generation Intel Xeon/Core i7 processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.
Flexible Design to Fit Any Application
The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a «cable-free» solution. Such a connector board can dramatically reduce assembly time and cost for the end system.
Rugged design
Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:
The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness
A bottom-side heat spreader provides more efficient cooling than a traditional heat sink
All components are rated and/or tested to ensure reliable −40 to +85 o C operation
Thermal Dissipation
Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.
I/O Expansion
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.
Cable Kit
The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.
Osbourne
Carrier and Dev Kit for NVIDIA Jetson AGX Orin
Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use.
Key highlights of Osbourne include:
Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras
10Gb Ethernet + 1GB Ethernet ports
Wide temperature operation — matching the range of the Orin module
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230)
I/O concentrator connector enables use with standard and custom I/O breakout boards
Osbourne is available as a carrier board alone or with an Orin module and fan sink installed and ready for use. A Linux OS based on Nvidia L4T and customized to support all I/O on Osbourne is available for free download.
Flexible I/O Connector Design
All I/O on Osbourne is accessed through a single high-speed, high-density connector along the board edge. This decouples the board design from any specific I/O connector arrangement and frees you to select whatever I/O connector scheme you want. Standard connector boards are available for typical use cases, including a panel-mount connector board for installation in an enclosure and a breakout board for use with cables.
Panel I/O Board
The Panel I/O board provides the ability to install Osbourne directly into an enclosure without the use of cables. All I/O is provided on a series of commercial-style connectors designed to be mounted in an enclosure front panel. Panel I/O boards can also be designed with right-angle orientation.
I/O Expansion
Osbourne includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of WiFi and other networking modules.
Mass storage is provided with an M.2 2242/2280 NVME socket and a Micro-SD card socket.
JETBOX-Nano
Rugged, durable enclosure for NVIDIA Jetson Nano development kit
Ever since its introduction in March of 2019, the NVIDIA Jetson Nano computer-on-module has been capturing the hearts and minds of AI systems builders everywhere. JETBOX-nano™ is a low-cost enclosure for the Jetson Nano development kit. The all-steel enclosure provides a rugged, durable enclosure solution for the Jetson Nano that measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). The combination of the Jetson Nano development kit with the JETBOX-nano means users can deploy a professional quality NVIDIA Jetson system with almost 500 gigaFlops performance.
The NVIDIA Jetson Nano Development Kit provides plenty of I/O for makers, learners, and developers.
The JETBOX-Nano measures a compact 125mm x 95mm x 34mm (approx. 4.9×3.7×1.3 inches). Its 2-part design makes assembly quick and easy. In addition to the standard front-facing I/O connectors, the enclosure provides access to the serial port and camera flex cable port on the Nano development kit’s left side and the GPIO port on its right. A programming button on the rear enables easy software updates, and a DIN rail mount makes installation in end equipment easy.
JETBOX-nano comes as an easy to construct kit that includes everything needed to construct the durable, quality enclosure designed to house the NVIDIA Jetson Nano development kit:
Top and bottom enclosure pieces with assembly hardware
Rear programming button
DIN rail mounting bracket
Optional GPIO cable (-02 model)
Easy-to-follow instructions for building JETBOX-nano
The JETBOX-nano enclosure kit is available in two configurations: The basic model and a GPIO-enabled model that includes a GPIO feature connector on the right side. The Nano development kit is purchased separately and is readily available from online vendors. Contact us for options regarding availability of a fully-assembled, ready-to-run system including the Nano development kit pre-installed.
