MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
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OSM-IMX93
OSM R1.1 Size-L module based on NXP i.MX93 series processor
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.
Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX93 is your ideal solution for various edge AI applications.
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DLAP-8100 Series
AI IPC with 15th/14th/13th/12th Intel Core Processor
ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.
The DLAP-8100 is a high-performance Edge AI platform, featuring 15th/14th/13th/12th Gen Intel Core 35W/65W LGA1700 CPUs and supporting up to 192GB DDR5 4800MHz memory via four SODIMM slots. Designed for compute-intensive AI workloads, the system accommodates a full-speed NVIDIA RTX A6000E 350W GPU with a PCIe Gen4×16 interface, enabling unparalleled AI inference and training capabilities at the edge.
For rich I/O, the DLAP-8100 includes 2x DP++, 2x HDMI, 3×2.5GbE, 4x COM ports, 8DI, 8DO, 4x USB 3.2, and 2x USB 3.1. It also supports up to four hot-swappable 2.5″ SATA 6 Gb/s drives with RAID 0/1/5/10 configurations, ensuring reliable and flexible data management for high-throughput applications.
Expansion is further enhanced with 1x M.2 2230 Key E (PCIe Gen3×1) for wireless modules or additional edge connectivity. The DLAP-8100 is the ideal platform for demanding edge AI scenarios such as industrial automation, video analytics, and smart manufacturing, delivering robust compute power and rich connectivity in a compact, industrial-grade form factor.
OSM-IMX93
OSM R1.1 Size-L module based on NXP i.MX93 series processor
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.
Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX93 is your ideal solution for various edge AI applications.
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DLAP-8100 Series
AI IPC with 15th/14th/13th/12th Intel Core Processor
ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.
The DLAP-8100 is a high-performance Edge AI platform, featuring 15th/14th/13th/12th Gen Intel Core 35W/65W LGA1700 CPUs and supporting up to 192GB DDR5 4800MHz memory via four SODIMM slots. Designed for compute-intensive AI workloads, the system accommodates a full-speed NVIDIA RTX A6000E 350W GPU with a PCIe Gen4×16 interface, enabling unparalleled AI inference and training capabilities at the edge.
For rich I/O, the DLAP-8100 includes 2x DP++, 2x HDMI, 3×2.5GbE, 4x COM ports, 8DI, 8DO, 4x USB 3.2, and 2x USB 3.1. It also supports up to four hot-swappable 2.5″ SATA 6 Gb/s drives with RAID 0/1/5/10 configurations, ensuring reliable and flexible data management for high-throughput applications.
Expansion is further enhanced with 1x M.2 2230 Key E (PCIe Gen3×1) for wireless modules or additional edge connectivity. The DLAP-8100 is the ideal platform for demanding edge AI scenarios such as industrial automation, video analytics, and smart manufacturing, delivering robust compute power and rich connectivity in a compact, industrial-grade form factor.
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DLAP-4100 Series
Industrial Mini-ITX System with Intel Core i9/i7/i5/i3 Processors
ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.
The DLAP-4100, featuring 15th/14th/13th/12th Gen Intel Core i9/i7/i5/i3 processors and Q670 chipset with up to 65W TDP, delivers exceptional performance for compute-intensive Edge AI workloads. It supports dual-channel DDR5 4800 MHz memory up to 64GB and provides flexible connectivity with three independent display outputs (HDMI 2.0b, HDMI 1.4b, DP 1.4a) and dual GbE ports (1×1GbE, 1×2.5GbE).
For AI acceleration, the DLAP-4100 supports GPU cards such as NVIDIA RTX series or Intel ARC graphics via its PCIe GEN5×16 slot, enabling advanced AI computing power for real-time inference, machine vision, and video analytics applications. Additionally, the DLAP-4100 is compatible with Hailo-8 M.2 AI acceleration modules, delivering up to 26 TOPS of performance with exceptional power efficiency. These modules support standard AI frameworks like TensorFlow, ONNX, PyTorch, and Keras, and are ideal for low-latency, multi-stream inference at the edge.
The platform’s expandability includes 4x USB 3.2 Gen2, 2x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, and 2x M.2 M-key slots, ensuring seamless integration of AI accelerators, wireless modules, and storage devices. This flexibility makes the DLAP-4100 a versatile solution for diverse AI edge deployments.
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cExpress-TL
COM Express Compact Size Type 6 Module with 11th Gen Intel Core and Celeron Processors (formerly codename: Tiger Lake-UP3)
ADLINK cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations.
Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI.
cExpress-TL features the Intel Iris Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel Iris Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
DLAP-4100 Series
Industrial Mini-ITX System with Intel Core i9/i7/i5/i3 Processors
ADLINK’s DLAP series provides robust, compact, industrial-grade fanless platforms, purpose-built for AI-based applications in challenging environments. These systems are equipped with powerful Intel processors and provide advanced AI capabilities, making them suitable for a wide range of applications in retail, parking, agriculture, and manufacturing. With an emphasis on SWaP (Size, Weight, and Power) optimization, these platforms are designed to excel in industrial and embedded settings, ensuring exceptional durability under extreme temperatures, shocks, and humidity.
The DLAP-4100, featuring 15th/14th/13th/12th Gen Intel Core i9/i7/i5/i3 processors and Q670 chipset with up to 65W TDP, delivers exceptional performance for compute-intensive Edge AI workloads. It supports dual-channel DDR5 4800 MHz memory up to 64GB and provides flexible connectivity with three independent display outputs (HDMI 2.0b, HDMI 1.4b, DP 1.4a) and dual GbE ports (1×1GbE, 1×2.5GbE).
For AI acceleration, the DLAP-4100 supports GPU cards such as NVIDIA RTX series or Intel ARC graphics via its PCIe GEN5×16 slot, enabling advanced AI computing power for real-time inference, machine vision, and video analytics applications. Additionally, the DLAP-4100 is compatible with Hailo-8 M.2 AI acceleration modules, delivering up to 26 TOPS of performance with exceptional power efficiency. These modules support standard AI frameworks like TensorFlow, ONNX, PyTorch, and Keras, and are ideal for low-latency, multi-stream inference at the edge.
The platform’s expandability includes 4x USB 3.2 Gen2, 2x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, and 2x M.2 M-key slots, ensuring seamless integration of AI accelerators, wireless modules, and storage devices. This flexibility makes the DLAP-4100 a versatile solution for diverse AI edge deployments.
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cExpress-TL
COM Express Compact Size Type 6 Module with 11th Gen Intel Core and Celeron Processors (formerly codename: Tiger Lake-UP3)
ADLINK cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations.
Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI.
cExpress-TL features the Intel Iris Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel Iris Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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cExpress-AR
COM Express Compact Size Type 6 Module with AMD Ryzen Embedded V2000 CPU (Zen 2 architecture)
The cExpress-AR, featuring the new AMD Ryzen V2000 CPU with its high performance integrated Radeon graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD’s Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC error correction based on selected SKUs and configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, make it well suited for mission critical application in harsh environments.
With integrated new generation AMD Radeon Vega graphics, the cExpress-AR supports up to four independent 4K displays via DisplayPort, HDMI, DVI and LVDS. The cExpress-AR, offers a range of high speed interfaces, including 2.5GbE Ethernet, 6 PCIe x1 Gen3 and 1 PCIe x8 Gen2 (configurable), and 4x USB 3.2 ports. These features are fully compatible with the COM Express Rev. 3 specification, allowing for existing systems to upgrade and gain in performance without changing the carrier design.
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cExpress-EL
COM Express Compact Size Type 6 Module with Next Generation Intel Atom Processor SoC
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
cExpress-AR
COM Express Compact Size Type 6 Module with AMD Ryzen Embedded V2000 CPU (Zen 2 architecture)
The cExpress-AR, featuring the new AMD Ryzen V2000 CPU with its high performance integrated Radeon graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD’s Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC error correction based on selected SKUs and configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, make it well suited for mission critical application in harsh environments.
With integrated new generation AMD Radeon Vega graphics, the cExpress-AR supports up to four independent 4K displays via DisplayPort, HDMI, DVI and LVDS. The cExpress-AR, offers a range of high speed interfaces, including 2.5GbE Ethernet, 6 PCIe x1 Gen3 and 1 PCIe x8 Gen2 (configurable), and 4x USB 3.2 ports. These features are fully compatible with the COM Express Rev. 3 specification, allowing for existing systems to upgrade and gain in performance without changing the carrier design.
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cExpress-EL
COM Express Compact Size Type 6 Module with Next Generation Intel Atom Processor SoC
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Microlog
Vehicle testing and tracking tool
The ODOS Microlog is perfectly suited for test vehicle tracking. Just plug it in and you are ready to monitor the vehicle. All is configured over the air! Perfect for any tracking and monitoring application for R&D use case as well as commercial use.
With the power of award-winning ODOS CloudSoft Professional Cloud software, you will take your test and measurement experience to another level over the air.
ODOS Microlog is a perfect tool for any vehicle testing department as you can carry out a large number of standard tests very simply with the quick installation and remote management with results being shown in real-time in ODOS Cloudsoft.
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CloudCommander
All-in-One CAN to Cloud datalogging solution
ODOSOLUTIONS AB (ODOS) and Kvaser AB have brought together a fresh perspective, unique collaboration, and advanced technology, in order to deliver next generation cloud connectivity and data logging for CAN (controller area network).
ODOS’ CloudCommander is a 4G-enabled data logger that integrates Kvaser’s well-known CAN interface hardware. ODOS’ Cloudsoft software platform, plus dashboard makes this a comprehensive CAN-to-Cloud data logging solution.
CloudCommander Features
The CloudCommander data logger combines the scale of Kvaser’s most popular CAN interface — the Kvaser Leaf Light — with the power of ODOS’ industry leading IoT Cloud Platform, to bring you a comprehensive CAN-to-Cloud datalogging solution:
Real-time CAN data streaming over 4G cellular connectivity to Cloud data storage
GPS tracking and 3-axis Accelerometer
Onboard UPS and memory buffer in the event of power and cellular connectivity outages
Native Kvaser Leaf (CANlib SDK) Interface and API
Rugged waterproof (IP67) field deployable enclosure with secure mounting location
CloudSoft Features
The tight vertical integration with award-winning CloudSoft platform and dashboard offers:
Remote real-time CAN data monitoring and analysis software
Over-The-Air (OTA) data-logger configuration updates
OTA Diagnostic Protocols on CAN (OBD2 & UDS)
Event based triggering to stream data, capture CAN traces and email alerts/reports
Virtual calculated CAN channels
Distributed team collaboration and data sharing platform
Plugins and REST API service
ASAM file formats
Certified to the most rigorous IT security and privacy (GDPR) legislation
What’s more, the CloudCommander incorporates a Kvaser USB-CAN interface to support your existing PC Applications whilst simultaneously streaming data to the cloud for remote fleet monitoring and diagnostics support.
Microlog
Vehicle testing and tracking tool
The ODOS Microlog is perfectly suited for test vehicle tracking. Just plug it in and you are ready to monitor the vehicle. All is configured over the air! Perfect for any tracking and monitoring application for R&D use case as well as commercial use.
With the power of award-winning ODOS CloudSoft Professional Cloud software, you will take your test and measurement experience to another level over the air.
ODOS Microlog is a perfect tool for any vehicle testing department as you can carry out a large number of standard tests very simply with the quick installation and remote management with results being shown in real-time in ODOS Cloudsoft.
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CloudCommander
All-in-One CAN to Cloud datalogging solution
ODOSOLUTIONS AB (ODOS) and Kvaser AB have brought together a fresh perspective, unique collaboration, and advanced technology, in order to deliver next generation cloud connectivity and data logging for CAN (controller area network).
ODOS’ CloudCommander is a 4G-enabled data logger that integrates Kvaser’s well-known CAN interface hardware. ODOS’ Cloudsoft software platform, plus dashboard makes this a comprehensive CAN-to-Cloud data logging solution.
CloudCommander Features
The CloudCommander data logger combines the scale of Kvaser’s most popular CAN interface — the Kvaser Leaf Light — with the power of ODOS’ industry leading IoT Cloud Platform, to bring you a comprehensive CAN-to-Cloud datalogging solution:
Real-time CAN data streaming over 4G cellular connectivity to Cloud data storage
GPS tracking and 3-axis Accelerometer
Onboard UPS and memory buffer in the event of power and cellular connectivity outages
Native Kvaser Leaf (CANlib SDK) Interface and API
Rugged waterproof (IP67) field deployable enclosure with secure mounting location
CloudSoft Features
The tight vertical integration with award-winning CloudSoft platform and dashboard offers:
Remote real-time CAN data monitoring and analysis software
Over-The-Air (OTA) data-logger configuration updates
OTA Diagnostic Protocols on CAN (OBD2 & UDS)
Event based triggering to stream data, capture CAN traces and email alerts/reports
Virtual calculated CAN channels
Distributed team collaboration and data sharing platform
Plugins and REST API service
ASAM file formats
Certified to the most rigorous IT security and privacy (GDPR) legislation
What’s more, the CloudCommander incorporates a Kvaser USB-CAN interface to support your existing PC Applications whilst simultaneously streaming data to the cloud for remote fleet monitoring and diagnostics support.
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5U Rugged Servers
Ruggedized | Scalable | Reliable
Dual Intel Xeon SP CPUs
Achieve exceptional performance with Intel Xeon Scalable Performance Silver & Gold Series processors. Up to 3.9 GHz clock rate, 22 cores (44 threads), 30.25 MB L3 cache, and 25W — 125W TDP.
Unforgettable Memory
Maximize signal integrity with 8 carefully optimized ECC RDIMMs across 6 channels and up to 1.5TB DDR4‑2933 memory.
Basically the best server-class RAM in a 5U rugged chassis.
Storage SATAsfied
Four 3.5″ drive bays supporting up to 16 SATA 6 Gb/s drives and one SlimLine Optical drive.
Lots of Slots
Comes standard with up to 18 PCIe Gen3 slots in a 5U rugged server offering the most application versatility and scalability.
Add even more PCIe slots to your ruggedized computer with our PCIe Expansion Kit.
Power. Full.
Up to 2200W of power to provide enough juice to run the most demanding application requirements with ease.
I/Options
2 - 1GbE LAN Ports (1 LAN Port with IPMI)
2 - 10GbE LAN Ports
4 - USB 3.1 Gen 1 Ports
1 - VGA Port
1 - RS-232 Serial Port
Line In/Line Out/Mic 3.5mm Jacks
Standard I/O interface can be customized to fit your specific program or application.
Components
Processor Boards
CPU
Memory
Ports & Headers
SEP8253
Dual Intel Xeon Scalable Performance
Up to 1.5 TB DDR4-2933 across 8x ECC RDIMMs (6x channels)
2x 1GbE LAN Ports (1 LAN Port with IPMI)
2x 10GbE LAN Ports
4x USB 3.1 Gen 1 Ports
1x SATA Header
1x VGA Port
1x RS-232 Serial Port
PCIe Backplanes
PCIe
Ports & Headers
HDB8259
14x Slots
4x PCIe Gen3×16
10x PCIe Gen3×8
2x USB 3.0 Gen 1 ports (via USB headers)
4x USB 2.0 ports
6x SATA/600 headers
HDB8231
18x Slots
2x PCIe Gen3×8
16x PCIe Gen3×4
2x USB 3.0 Gen 1 ports (via USB headers)
4x USB 2.0 ports
6x SATA/600 headers
HDB8237
(4x segments)
4x Slots
4x PCIe Gen3×16
2x USB 3.0 Gen 1 ports (via USB headers)
4x SATA/600 headers
Rugged Chassis
Power Supply
Drives
Size (W x H x D)
THS5095
1200W Redundant
Two 3.5″ drive bays supporting up to 6 SATA 6 Gb/s drives and one SlimLine optical drive
19″ x 8.75″ x 19.5″
48.3cm x 22.2cm x 49.5cm
THS5087
1550W N+1 or 2430W N+1
Four 3.5″ drive bays supporting up to 12 SATA 6 Gb/s drives and one SlimLine optical drive
19″ x 8.75″ x 23″
48.3cm x 22.2cm x 58.4cm
THS5090
(2 segments)
1000W Removable (2)
One 3.5″ drive bay supporting up to 3 SATA 6 Gb/s drives and one SlimLine Optical drive per segment
19″ x 8.75″ x 19.2″
48.3cm x 22.2cm x 66cm
THS5091
(4 segments)
800W Removable (4)
No drives for enhanced data security
19″ x 8.75″ x 19.2″
48.3cm x 22.2cm x 66cm
PCIe Expansion Kit
Description
PED8234
Add up to 18 PCIe slots per x16 slot in any system
with either a 1m or 3m cable.
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ADLEPC-1700
Intel E3900-Series Atom, Compact Industrial PC
The ADLEPC-1700 is a rugged, compact industrial-grade computer constructed from 6063 aluminum, with thick‑walled design and a fanless, conduction-cooled CPU for industrial temperature operation. It features a durable annodized finish, flush-mounted screws, and flexible mounting options. The compact size and light weight make it ideal for a variety of industrial applications and environments, whether on the factory floor or in rugged external conditions.
Customizable High Performance
At the heart of the ADLEPC-1700 is a compact Intel Atom E3900-series SBC with a host of onboard and mPCIe expansion features. The compact chassis design has a very small footprint at only a 3.3″ x 4.6″, the approximate size of an index card, making it ideal for embedded use in IIot applications or retrofitting into high-value assets and infrastructure such as edge devices for power grid protection, oil and gas, unmanned applications, and more.
Custom I/O and Power
The EPC-1700 is highly customizable and can easily be adapted for particular customer needs including Wi-Fi, CAN, RS232, military-grade power, MIL-STD-1553, ARINC, and much more.
ADL Embedded Solutions, Inc. offers full turnkey system design services and is well versed at working collaboratively with customers to conceptualize and manufacture full custom EPC-1700 solutions or even full-custom system solutions. Contact us for details.
5U Rugged Servers
Ruggedized | Scalable | Reliable
Dual Intel Xeon SP CPUs
Achieve exceptional performance with Intel Xeon Scalable Performance Silver & Gold Series processors. Up to 3.9 GHz clock rate, 22 cores (44 threads), 30.25 MB L3 cache, and 25W — 125W TDP.
Unforgettable Memory
Maximize signal integrity with 8 carefully optimized ECC RDIMMs across 6 channels and up to 1.5TB DDR4‑2933 memory.
Basically the best server-class RAM in a 5U rugged chassis.
Storage SATAsfied
Four 3.5″ drive bays supporting up to 16 SATA 6 Gb/s drives and one SlimLine Optical drive.
Lots of Slots
Comes standard with up to 18 PCIe Gen3 slots in a 5U rugged server offering the most application versatility and scalability.
Add even more PCIe slots to your ruggedized computer with our PCIe Expansion Kit.
Power. Full.
Up to 2200W of power to provide enough juice to run the most demanding application requirements with ease.
I/Options
2 - 1GbE LAN Ports (1 LAN Port with IPMI)
2 - 10GbE LAN Ports
4 - USB 3.1 Gen 1 Ports
1 - VGA Port
1 - RS-232 Serial Port
Line In/Line Out/Mic 3.5mm Jacks
Standard I/O interface can be customized to fit your specific program or application.
Components
Processor Boards
CPU
Memory
Ports & Headers
SEP8253
Dual Intel Xeon Scalable Performance
Up to 1.5 TB DDR4-2933 across 8x ECC RDIMMs (6x channels)
2x 1GbE LAN Ports (1 LAN Port with IPMI)
2x 10GbE LAN Ports
4x USB 3.1 Gen 1 Ports
1x SATA Header
1x VGA Port
1x RS-232 Serial Port
PCIe Backplanes
PCIe
Ports & Headers
HDB8259
14x Slots
4x PCIe Gen3×16
10x PCIe Gen3×8
2x USB 3.0 Gen 1 ports (via USB headers)
4x USB 2.0 ports
6x SATA/600 headers
HDB8231
18x Slots
2x PCIe Gen3×8
16x PCIe Gen3×4
2x USB 3.0 Gen 1 ports (via USB headers)
4x USB 2.0 ports
6x SATA/600 headers
HDB8237
(4x segments)
4x Slots
4x PCIe Gen3×16
2x USB 3.0 Gen 1 ports (via USB headers)
4x SATA/600 headers
Rugged Chassis
Power Supply
Drives
Size (W x H x D)
THS5095
1200W Redundant
Two 3.5″ drive bays supporting up to 6 SATA 6 Gb/s drives and one SlimLine optical drive
19″ x 8.75″ x 19.5″
48.3cm x 22.2cm x 49.5cm
THS5087
1550W N+1 or 2430W N+1
Four 3.5″ drive bays supporting up to 12 SATA 6 Gb/s drives and one SlimLine optical drive
19″ x 8.75″ x 23″
48.3cm x 22.2cm x 58.4cm
THS5090
(2 segments)
1000W Removable (2)
One 3.5″ drive bay supporting up to 3 SATA 6 Gb/s drives and one SlimLine Optical drive per segment
19″ x 8.75″ x 19.2″
48.3cm x 22.2cm x 66cm
THS5091
(4 segments)
800W Removable (4)
No drives for enhanced data security
19″ x 8.75″ x 19.2″
48.3cm x 22.2cm x 66cm
PCIe Expansion Kit
Description
PED8234
Add up to 18 PCIe slots per x16 slot in any system
with either a 1m or 3m cable.
new
ADLEPC-1700
Intel E3900-Series Atom, Compact Industrial PC
The ADLEPC-1700 is a rugged, compact industrial-grade computer constructed from 6063 aluminum, with thick‑walled design and a fanless, conduction-cooled CPU for industrial temperature operation. It features a durable annodized finish, flush-mounted screws, and flexible mounting options. The compact size and light weight make it ideal for a variety of industrial applications and environments, whether on the factory floor or in rugged external conditions.
Customizable High Performance
At the heart of the ADLEPC-1700 is a compact Intel Atom E3900-series SBC with a host of onboard and mPCIe expansion features. The compact chassis design has a very small footprint at only a 3.3″ x 4.6″, the approximate size of an index card, making it ideal for embedded use in IIot applications or retrofitting into high-value assets and infrastructure such as edge devices for power grid protection, oil and gas, unmanned applications, and more.
Custom I/O and Power
The EPC-1700 is highly customizable and can easily be adapted for particular customer needs including Wi-Fi, CAN, RS232, military-grade power, MIL-STD-1553, ARINC, and much more.
ADL Embedded Solutions, Inc. offers full turnkey system design services and is well versed at working collaboratively with customers to conceptualize and manufacture full custom EPC-1700 solutions or even full-custom system solutions. Contact us for details.
