MicroMax's Solutions
MicroMax's Solutions
MicroMax's Solutions
Express-DN7
COM Express Basic Size Type 7 Module with Intel Atom C3000 SoC
The Express-DN7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom C3000 processor (formerly «Denverton-NS») system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
The Express-DN7 features Intel Quick Assist Technology (cryptographic and compression acceleration), Intel Virtualization Technology (including VT-x, VT-d), Intel AES-NI Technology, and DDR4 ECC (or non-ECC) dualchannel memory at 1866/2133/2400 MHz (dependent on SoC SKU) to provide excellent overall performance. In addition, the Express-DN7 has up to three SODIMM sockets supporting up to 48GB of DDR4 ECC (or non-ECC) memory that is fully compliant with the COM Express mechanical specification.
An integrated Intel 10G Ethernet controller supports a maximum of four 10GBASE-KR interfaces, relevant sideband signals and NC-SI. The Express-DN7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time. Input/output features include expanded PCIe bandwidth up to two PCIe x8 Gen3 lanes, a single onboard Gigabit Ethernet port with IEEE 1588 support suitable for real-time applications, USB 3.0/2.0 ports, and SATA 6 Gb/s ports.
Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
Express-BD74
COM Express Basic Size Type 7 Module with Intel Xeon D SoC and 4 SODIMMs
The Express-BD74 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D (formerly «Broadwell-DE») system-on-chip (SoC) with up to 4 SO-DIMMs to boost system performance. The Express-BD74 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
The Express-BD74 features Intel Virtualization Technology (including VT-x, VT-d, EPT), Intel Hyper-Threading Technology (up to 16 cores, 32 threads), Intel Trusted Execution Technology, Intel AES-NI Technology, and 4 SO-DIMMs to provide a maximum of 128GB DDR4 ECC (or non-ECC) memory capacity and dual-channel memory design at 1866/2133/2400 MHz (dependent on SoC SKU) for excellent overall performance.
An integrated Intel 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI. The Express-BD74 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.
Input/output features include 24 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.
Q7-BT
Qseven Module with 4th Generation Intel Atom Processor E3800 Series SoC
The Q7-BT Computer-On-Module (COM) combines the Qseven 2.0 standard with the Intel Atom E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
The Qseven form factor affords a more compact profile and footprint than the other COM platforms.
With mechanical dimensions as small as 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as the smallest COM standard currently available.
The Q7-BT module utilizes the E3800 SoC for contemporary, high-bandwidth interfaces such as PCI Express, USB, Gigabit Ethernet, SATA, and HD Audio. The module generates its own LVDS, TMDS, and DisplayPort video signals using DDI output from the SoC. A series of optional eMMC devices offers up to 64GB of on-board NAND Flash storage with an MMC interface, and an optional SATA, Solid State Drive (SSD) provides up to 64GB of on-board NAND Flash storage. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system.
Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection—counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC. The optional SEMA Cloud utility not only controls local events on the module but system client events on the IoT.
LEC-BT
SMARC Full Size Module with Intel Atom Processor E3800 Series System-on-Chip
The SMARC («Smart Mobility ARChitecture») is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
SMARC form factor module, the LEC-BT, is certified by Intel for Intel Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration.
To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
LEC-iMX6
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
The SMARC («Smart Mobility ARChitecture») is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
cExpress-WL
COM Express Compact Size Type 6 Module with Up to Quadcore Intel Core and Celeron Processors
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel Core and Celeron processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
cExpress-WL modules are equipped with the 8th generation Intel Core processor and Celeron processor. These quad-core processors support up to 8 threads and an impressive turbo boost of up to 4.8 GHz, delivering 40% performance at increase at 15 watt of thermal design power (TDP) at a similar cost. ADLINK’s cExpress-WL provides standard support for up to 64GB non-ECC DDR4 in two SO-DIMMs, while still fully complying with PICMG COM.0 mechanical specifications.
cExpress-KL
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel Core and Celeron Processors (formerly codename: Kaby Lake)
The cExpress-KL is a COM Express COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel Core i7/i5/i3 and Intel Celeron Ultra-Low TDP processors (formerly «Kaby Lake U») with CPU, memory controller, graphics processor and I/O hub on a single chip.
Leveraging the benefits provided by the 7th generation Intel Core and Celeron System-on-Chip, the cExpress-KL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel’s Configurable TDP in a long product life solution.
The cExpress-KL’s Intel processors support Intel Hyper- Threading Technology (up to 2 cores, 4 threads) and up to 32 GB of non-ECC DDR4 dual-channel memory at 1866/2133 MHz in dual stacked SODIMM sockets to provide excellent overall performance. Integrated Intel Generation 9 Low Power Graphics includes features such as OpenGL 4.4/4.3, DirectX 11.3/11, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA2) support for AVC/VC1/MPEG2/HEVC/VP8/JPEG hardware decode and AVC/MPEG2/HEVC/VP8/JPEG hardware encode.
Graphics outputs include dual-channel 18/24-bit LVDS (eDP by build option), two DDI ports supporting HDMI/DVI/DisplayPort and VGA (by build option). The cExpress-KL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-KL features a single onboard Gigabit Ethernet port, up to six PCIe Gen3 ports (build option), four USB 3.0 ports, four USB 2.0 ports, and three SATA 6Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.
cExpress-AL
COM Express Compact Size Type 6 Module Intel Atom E3900 series, Pentium, and Celeron SoC (formerly Apollo Lake)
The cExpress-AL is a COM Express COM.0 R3.0 Type 6 module supporting the Intel Atom processor, Intel Pentium processor and Intel Celeron processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
The Intel Atom processor, Intel Pentium processor and Intel Celeron processor and support non-ECC type DDR3L dual-channel memory at 1600/1867 MHz to provide excellent overall performance. Integrated Intel Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0; and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Up to three independent displays are available from DDI ports supporting HDMI/DVI/DisplayPort, optional VGA, single/dual-channel 18/24-bit LVDS and optional eDP.
The cExpress-AL is specifically designed for customers with balanced performance/power consumption requirements who want to outsource the custom core logic of their systems for reduced development time. The cExpress-AL has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. Featured IO include a single Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, SATA 6 Gb/s ports, and up to 5 PCIe x1 lanes. In addition, SD signals are muxed with GPIO. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer. An optional eMMC 5.0 (8/16/32 GB) is supported.
Express-TL
COM Express Basic Size Type 6 Module with Intel Core/Xeon/Celeron Processors
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel Core, Xeon W and Celeron 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution.
Featuring brand new Gen 12 Intel UHD Graphics and Intel AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options.
Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel AVX-512 VNNI, Intel OpenVINO toolkit and Intel UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
Express-ADP
COM Express Basic Size Type 6 Module with 12th Gen Intel Core Processor
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel Core processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities.
The integrated Intel Iris Xe graphics, with up to 96EUs, offers four concurrent 4K60 HDR displays and Intel Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
